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| (R) BTA/BTB08 and T8 Series 8A TRIACS SNUBBERLESSTM, LOGIC LEVEL & STANDARD MAIN FEATURES: A2 A2 A2 Symbol IT(RMS) VDRM/VRRM IGT (Q1) Value 8 600 and 800 5 to 50 Unit A V mA G A1 A2 G A1 A2 A1 G DPAK (T8-B) A2 D2PAK (T8-G) DESCRIPTION Available either in through-hole or surface-mount packages, the BTA/BTB08 and T8 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,... The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734) ABSOLUTE MAXIMUM RATINGS Symbol IT(RMS) Parameter RMS on-state current (full sine wave) A1 A2 G IPAK (T8-H) A2 A1 A2 G A1 A2 G TO-220AB Insulated (BTA08) TO-220AB (BTB08) Value Tc = 110C 8 Tc = 100C t = 20 ms t = 16.7 ms 80 84 36 Tj = 125C Tj = 125C Tj = 125C 50 4 1 - 40 to + 150 - 40 to + 125 Unit DPAK / DPAK IPAK / TO-220AB TO-220AB Ins. A ITSM Non repetitive surge peak on-state current (full cycle, Tj initial = 25C) I t Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range F = 50 Hz F = 60 Hz A It dI/dt IGM PG(AV) Tstg Tj tp = 10 ms F = 120 Hz tp = 20 s A s A/s A W C 1/10 April 2002 - Ed: 5A BTA/BTB08 and T8 Series ELECTRICAL CHARACTERISTICS (Tj = 25C, unless otherwise specified) s SNUBBERLESSTM and LOGIC LEVEL (3 Quadrants) Symbol Test Conditions Quadrant T810 IGT (1) VGT VGD IH (2) IL dV/dt (2) (dI/dt)c (2) VD = 12 V RL = 30 I - II - III I - II - III I - II - III MAX. MAX. MIN. MAX. I - III II VD = 67 %VDRM gate open Tj = 125C (dV/dt)c = 0.1 V/s Tj = 125C (dV/dt)c = 10 V/s Without snubber Tj = 125C Tj = 125C MIN. MIN. MAX. 15 25 30 40 5.4 2.8 35 50 60 400 4.5 10 10 15 20 3.5 1.5 10 T8 T835 35 TW 5 1.3 0.2 15 25 30 40 5.4 2.8 35 50 60 400 4.5 50 70 80 1000 7 V/s A/ms BTA/BTB08 SW 10 CW 35 BW 50 mA V V mA mA Unit VD = VDRM RL = 3.3 k Tj = 125C IT = 100 mA IG = 1.2 IGT s STANDARD (4 Quadrants) Symbol Test Conditions Quadrant BTA/BTB08 C IGT (1) VD = 12 V VGT VGD IH (2) IL dV/dt (2) VD = VDRM RL = 3.3 k Tj = 125C IT = 500 mA IG = 1.2 IGT VD = 67 %VDRM gate open Tj = 125C Tj = 125C I - III - IV II MIN. MIN. RL = 30 I - II - III IV ALL ALL MAX. MAX. MIN. MAX. MAX. 25 40 80 200 5 25 50 1.3 0.2 50 50 100 400 10 V/s V/s B 50 100 mA V V mA mA Unit (dV/dt)c (2) (dI/dt)c = 3.5 A/ms STATIC CHARACTERISTICS Symbol VTM (2) Vto (2) Rd (2) IDRM IRRM Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1 Test Conditions ITM = 11 A tp = 380 s Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C MAX. MAX. MAX. MAX. Value 1.55 0.85 50 5 1 Unit V V m A mA Threshold voltage Dynamic resistance VDRM = VRRM 2/10 BTA/BTB08 and T8 Series THERMAL RESISTANCES Symbol Rth(j-c) Junction to case (AC) Parameter DPAK / DPAK IPAK / TO-220AB TO-220AB Insulated Rth(j-a) Junction to ambient S = 1 cm Value 1.6 2.5 45 70 60 100 Unit C/W D PAK DPAK TO-220AB TO-220AB Insulated IPAK C/W S = 0.5 cm S = Copper surface under tab PRODUCT SELECTOR Voltage (xxx) Part Number 600 V BTA/BTB08-xxxB BTA/BTB108-xxxBW BTA/BTB08-xxxC BTA/BTB08-xxxCW BTA/BTB08-xxxSW BTA/BTB08-xxxTW T810-xxxB T810-xxxH T835-xxxB T835-xxxG T835-xxxH BTB: non insulated TO-220AB package Sensitivity 800 V X X X X X X X X X X X 50 mA 50 mA 25 mA 35 mA 10 mA 5 mA 10 mA 10 mA 35mA 35 mA 35 mA X X X X X X X X X X X Type Standard Snubberless Standard Snubberless Logic level Logic level Logic level Logic level Snubberless Snubberless Snubberless Package TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB DPAK IPAK DPAK DPAK IPAK 3/10 BTA/BTB08 and T8 Series ORDERING INFORMATION BT A 08 TRIAC SERIES INSULATION: A: insulated B: non insulated CURRENT: 8A 600 BW (RG) PACKING MODE Bulk: Blank RG: Tube VOLTAGE: 600: 600V 800: 800V SENSITIVITY & TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS C: 25mA STANDARD CW: 35mA SNUBBERLESS SW: 10mA LOGIC LEVEL TW: 5mA LOGIC LEVEL T TRIAC SERIES CURRENT: 8A 8 10 - 600 B PACKAGE: B: DPAK G: D2PAK H: IPAK (-TR) VOLTAGE: 600: 600V 800: 800V SENSITIVITY: 10: 10mA 35: 35mA PACKING MODE: Blank: Tube -TR: DPAK / D2PAK Tape & Reel OTHER INFORMATION Part Number BTA/BTB08-xxxyz BTA/BTB08-xxxyzRG T8yy-xxxB T8yy-xxxB-TR T8yy-xxxH T8yy-xxxG T8yy-xxxG-TR Marking BTA/BTB08xxxyz BTA/BTB08-xxxyz T8yyxxx T8yyxxx T8yyxxx T8yyxxx T8yyxxx Weight 2.3 g 2.3 g 0.3 g 0.3 g 0.4 g 1.5 g 1.5 g Base quantity 250 50 75 2500 75 50 1000 Packing mode Bulk Tube Tube Tape & reel Tube Tube Tape & reel Note: xxx = voltage, yy = sensitivity, z = type 4/10 BTA/BTB08 and T8 Series Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle). P (W) 10 9 8 7 6 5 4 3 2 1 0 Fig. 2-1: RMS on-state current versus case temperature (full cycle). IT(RMS) (A) 10 9 8 7 6 5 4 3 2 1 0 BTB/T8 BTA IT(RMS)(A) Tc(C) 0 1 2 3 4 5 6 7 8 0 25 50 75 100 125 Fig. 2-2: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35m),full cycle. IT(RMS) (A) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 Tamb(C) DPAK (S=0.5cm2) D2PAK (S=1cm2) Fig. 3: Relative variation of thermal impedance versus pulse duration. K=[Zth/Rth] 1E+0 Zth(j-c) DPAK/IPAK Zth(j-a) 1E-1 TO-220AB/DPAK Zth(j-a) 1E-2 tp(s) 50 75 100 125 1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Fig. 4: values). ITM (A) 100 On-state characteristics (maximum Fig. 5: Surge peak on-state current versus number of cycles. ITSM (A) Tj max. Vto = 0.85 V Rd = 50 m Tj=Tj max 10 Tj=25C VTM(V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 90 80 70 60 50 40 30 20 10 0 t=20ms One cycle Non repetitive Tj initial=25C Repetitive Tc=100C Number of cycles 1 10 100 1000 5/10 BTA/BTB08 and T8 Series Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of It. ITSM (A), It (As) 1000 Tj initial=25C Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values). IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25C] 2.5 2.0 dI/dt limitation: 50A/s IGT ITSM 1.5 IH & IL 100 1.0 It 0.5 tp (ms) 10 0.01 0.10 1.00 10.00 Tj(C) 0.0 -40 -20 0 20 40 60 80 100 120 140 Fig. 8-1: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). Snubberless & Logic Level Types (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.2 2.0 TW 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 (dV/dt)c (V/s) 0.2 0.0 0.1 1.0 10.0 Fig. 8-2: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values). Standard Types (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.0 1.8 1.6 1.4 B C T835/CW/BW 1.2 1.0 0.8 0.6 100.0 (dV/dt)c (V/s) T810/SW 0.4 0.1 1.0 10.0 100.0 Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature. Fig. 10: DPAK and D 2PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 m). Rth(j-a) (C/W) 100 90 80 70 60 50 40 30 20 10 0 (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 3 2 1 0 0 25 Tj(C) DPAK DPAK S(cm) 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40 6/10 BTA/BTB08 and T8 Series PACKAGE MECHANICAL DATA DPAK (Plastic) DIMENSIONS REF. Millimeters Min. A A1 A2 B B2 C C2 D E G H L2 L4 R V2 Max Min. Inches Max. 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0.2 typ. 0 8 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0.007 typ. 0 8 FOOTPRINT DIMENSIONS (in millimeters) DPAK (Plastic) 6.7 6.7 3 3 1.6 2.3 2.3 1.6 7/10 BTA/BTB08 and T8 Series PACKAGE MECHANICAL DATA DPAK (Plastic) DIMENSIONS A E L2 C2 REF. Millimeters Min. Typ. Max. 4.60 2.69 0.23 0.93 Min. Inches Typ. Max. D L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R A A1 A2 B B2 C C2 D E G L L2 L3 R V2 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0 1.40 0.40 0.169 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.048 0.055 0.60 0.017 0.024 1.36 0.047 0.054 9.35 0.352 0.368 10.28 0.393 0.405 5.28 0.192 0.208 15.85 0.590 0.624 1.40 0.050 0.055 1.75 0.055 0.069 0.016 8 0 8 FOOTPRINT DIMENSIONS (in millimeters) DPAK (Plastic) 16.90 10.30 1.30 5.08 3.70 8.90 8/10 BTA/BTB08 and T8 Series PACKAGE MECHANICAL DATA IPAK (Plastic) DIMENSIONS REF. Millimeters Min. A E B2 L2 C2 Inches Min. 0.086 0.035 0.027 0.025 0.204 0.035 Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.033 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.031 0.039 10 Typ. Max. 2.4 1.1 1.3 0.9 5.4 0.85 D H L L1 B6 B3 B V1 A1 B5 G C A3 A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 V1 2.2 0.9 0.7 0.64 5.2 0.3 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 10 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 9/10 BTA/BTB08 and T8 Series PACKAGE MECHANICAL DATA TO-220AB Ins. B DIMENSIONS C b2 REF. Millimeters Min. Typ. 3.75 Max. Min. Inches Typ. 0.147 Max. 0.625 L F I A l4 a1 c2 l3 l2 a2 b1 e M c1 A a1 a2 B b1 b2 C c1 c2 e F I I4 L l2 l3 M 15.20 15.90 0.598 13.00 14.00 0.511 0.551 10.00 10.40 0.393 0.409 0.61 0.88 0.024 0.034 1.23 1.32 0.048 0.051 4.40 4.60 0.173 0.181 0.49 0.70 0.019 0.027 2.40 2.72 0.094 0.107 2.40 2.70 0.094 0.106 6.20 6.60 0.244 0.259 3.75 3.85 0.147 0.151 15.80 16.40 16.80 0.622 0.646 0.661 2.65 2.95 0.104 0.116 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 2.60 0.102 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. (c) The ST logo is a registered trademark of STMicroelectronics (c) 2002 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Isreal - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 10/10 |
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